POLYMELT 756 琥珀色颗粒
POLYMELT PA 756 high performance thermoplastic polyamide is designed to meet low pressure molding process requirements. This product can be processed at low processing pressure due to its low viscosity, allowing encapsulation of fragile components without damage. This material produces no toxic fumes in process and provides a good balance of low and high temperature performance.
POLYMELT PA 756 AMBER |
||||
基本组成 Technology | Polyamide 聚酰胺 | |||
外观颜色 Appearance | AMBER 琥珀色 | |||
耐高温 Temperature creep resistance, ℃ | +150 ℃ | |||
耐低温 Low Temperature Flexibility, ℃ | -40 ℃ | |||
操作温度 Application Temperature, ℃ | 220 to 240 ℃ | |||
软化点 Softening Point, ℃ | 180 to 190 | |||
粘性 Melting Viscosity, mPa·s At, ℃ |
3,000 to 4,000 @220℃ |
|||
硬度 Hardness | Shore A 90 | |||
断裂伸张率 Elongation, % | >400 | |||
玻璃化温度 Glass Transition, ℃ | -40 | |||
包装 Packaging | 颗粒 Granule 20Kg bag | |||
阻燃性 Flammability Rating | UL 94 V-0 | |||
ADHESION CAPABILITY 胶粘特性 / 黏着力 剥离强度*6 N/mm |
金属(2)(铝/铜合金+铁) Metals (2) (AL/Cu-alloys + steel) | 2 | EP | 2 |
玻璃 Glass | 4 | PS | 0.1 | |
陶瓷 Ceramic | 4 | ABS | 6 | |
PVC | 7 | PPO | 4 | |
PE | - | PA | 4 | |
PP | - | PC | 4 | |
PBTP | 3 | PUR | 1 | |
PETP | 3 | PCB | 4 | |
以上信息均基于我们的实践知识与经验。所有数据均为典型值,不是产品规格。由于基材的多样性和应用环境的不确定性,我们强烈建议使用前进行试验。以上信息或者个人咨询均不构成任何保证和承担任何责任,经我们书面确认的咨询内容除外。 本网页中提供的产品技术信息仅供参考。它们会随不同的工况条件,如设备类型,材质,工艺条件等改变。 |